+86 21 34616270
info@sitchip.com
徐汇区裕德路168号徐汇商务大厦619室
  • 关于芯桥
  • 新闻
  • 解决方案
  • 产品
    • Synopsys
      • Galaxy平台
      • Design Ware IP
      • Discovery平台
      • System-level Design & Analysis
    • CEVA
    • Arteris
    • VeriSilicon
    • Vivante
    • SILEXICA
  • 服务与培训
    • 专业服务
    • 培训安排
  • 合作伙伴
    • Synopsys
    • CEVA
    • Arteris
    • VeriSilicon
    • Vivante
    • SILEXICA
  • 人才招聘
  • 联系我们
  • About SIT

FlexLLI™ MIPI Low Latency Interface (MIPI LLI) Digital Controller Interchip Connectivity IP

首页 产品 Arteris Arteris Products FlexLLI™ MIPI Low Latency Interface (MIPI LLI) Digital Controller Interchip Connectivity IP

Silicon-Proven

Arteris® FlexLLI digital controller IP is the industry’s first and only silicon-proven implementation of the MIPI Low Level Interface (LLI) specification.

LLI Use Models

FlexLLI MIPI LLI use modelArteris FlexLLI digital controller IP can connect two chips together to create a single “virtual chip”, with both chips sharing a single DRAM. LLI’s initial expected purpose is to connect a mobile phone applications processor to a mobile phone modem.

The ~80ns round-trip latency of an LLI connection is fast enough for the modem to share the application processor’s RAM. This enables the phone manufacturer to remove the modem’s dedicated RAM chip from the phone’s bill of materials (BOM).

FlexLLI can also be used in non-mobile applications where low latency and high bandwidth between chips is required, such as co-processing and companion chip applications.

FlexLLI does not require a runtime software stack, unlike other standards like USB and PCIe.

BoM Cost and PCB Area Benefits

FlexLLI Advantages

BoM Cost Savings ~$1.25 256Mb LPDDR1
~$2.00 512Mb LPDDR2
(cost estimates for 2012)
PCB Area Savings 72 mm2 (8x9mm) for LPDDR1
115 mm2 (10×11.5mm) for LPDDR2

Using Arteris FlexLLI saves a mobile phone vendor $1 to 2 from RAM cost savings alone. This savings is even larger when one includes the benefits of reduced board area.

FlexLLI Benefits to SoC Developers

FlexLLI Advantages

Lowest Risk • FlexLLI is the ONLY silicon-proven LLI digital IP.
• Arteris was a major contributor to the MIPI LLI specification.
Easiest Shares FlexNoC’s automated environment for fast LLI configuration and verification setup
Most Flexible Extensive configuration options for easier integration and fastest time to market

In addition to being the lowest risk option for implementing MIPI LLI, Arteris FlexLLI is also the easiest and fastest to implement because it shares Arteris FlexNoC’s automated design environment for fast configuration and verification setup. FlexLLI also offers extensive configuration options for quicker SoC integration and fastest time to market.

Arteris Experience and Innovation

Arteris is a major contributor to the MIPI Low Latency Interface specification and has extensive experience in network on chip technology and SoC interconnect IP with its FlexNoC product line. Arteris helped pioneer low latency interconnect IP, working with Texas Instruments to create and market the C2C Chip to Chip Link product.

Learn more about interchip connectivity IP by reading, “Interchip Connectivity: HSIC, UniPro, HSI, C2C, LLI…oh my!”

Synopsys-Arteris joint solution for MIPI LLI

Arteris and Synopsys jointly offer analog and digital IP solution to implement the MIPI Alliance Low Latency Interface (LLI) 1.0 specification. This solution consists of the Synopsys DesignWare MIPI M-PHY IP and Arteris FlexLLI LLI digital controller IP.

By providing a collaborative solution that adheres to the LLI specification, Arteris and Synopsys give system-on-chip (SoC) designers access to pre-tested and pre-optimized analog and digital MIPI-based IP that can reduce design cost and accelerate time to market.

Learn more about the Synopsys-Arteris LLI joint solution by reading, “Synopsys and Arteris Develop IP Solution to Reduce Mobile Phone Memory Costs.”

Trademark notice: “C2C”, “Chip to Chip Link”, “C2C Link” and “C2C Interface” are trademarks of Texas Instruments, Inc. Synopsys and DesignWare are registered trademarks or Synopsys, Inc. 

近期文章

  • Synopsys推进虚拟原型技术可支持系统和半导体供应链合作缔造下一代SoC
  • 展讯公司采用Synopsys的ZeBu Server硬件加速器作为其高级移动SoC的标准化开发平台
  • Socionext使用Synopsys TetraMAX II加快测试向量生成并降低测试成本
  • 2016 Synopsys SNUG China(上海站)五月隆重开幕【欢迎报名】
  • Silexica 诚邀您共同迎接多核技术挑战
  • Synopsys SIT Silicon to Software成都研讨会
  • Synopsys推出高性能嵌入式视觉处理器IP
  • Ramon 公司采用CEVA DSP 核 设计空间应用抗核辐照高性能并行处理器
  • Synopsys推出高性能嵌入式视觉处理器IP
  • 新思科技Synopsys虚拟原型设计专著发行超3000本,读者覆盖超1000家公司


上海芯桥信息技术有限公司 SiT (Shanghai) Co., LTD
沪ICP备12038304号